Siltectra: SILTECTRA reports application of COLD SPLIT wafer thinning technology to GaAs

At the SEMICON West 2018 tradeshow and conference in San Francisco (10-12 July), wafering technology firm SILTECTRA GmbH of Dresden, Germany has revealed new enabling and cost-of-ownership (CoO) advantages for its COLD SPLIT laser-based wafer thinning technology. Collectively, the benefits aim to further enable manufacturers of power semiconductors...