Siltectra
develops a wafer-thinning procedure for splitting crystalline materials and silicon carbide wafers... Read moreSiltectra
develops a wafer-thinning procedure for splitting crystalline materials and silicon carbide wafers... Read more
News
Nov 19, 2018
LEDinside
Siltectra: Infineon Acquires SiC Wafer Technology Startup Siltectra
Nov 13, 2018
Global Purchasing
Siltectra: Infineon Acquisition of Siltectra Enables Key SiC Advance
Nov 12, 2018
EE News Automotive
Siltectra: Infineon forges ahead with power semi factory, acquires SiC company
Oct 04, 2018
Semiconductor Today
Siltectra: SILTECTRA prepares to launch outsourced wafering services business
Jul 10, 2018
Semiconductor Today
Siltectra: SILTECTRA reports application of COLD SPLIT wafer thinning technology to GaAs
May 21, 2018
Semiconductor Today
Siltectra: Siltectra's new patents extend SiC process to split substrates with sub-100μm material loss
Feb 26, 2018
Solid State Technology
Siltectra: SILTECTRA's "twinning" breakthrough promises to vastly reduce wafering costs for manufacturers of silicon carbide-based IC devices
Feb 26, 2018
Semiconductor Today
Siltectra: SILTECTRA validates twinned SiC wafer produced using COLD SPLIT laser-based wafer thinning technique
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