Press Release: Ziptronix : Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions

SAN JOSE, Calif.--(BUSINESS WIRE)--Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) ("Tessera" or the "Company") and the leader in low temperature wafer bonding technology, today announced it has entered into a development agreement with Fraunhofer IZM-ASSID ("Fraunhofer"). The companies will work together to integrate Ziptronix Direct Bond Interconnect (DBI®) technology into Fraunhofer's state of the art 300mm wafer production line and demonstrate DBI as t