MonolithIC 3D Blog EV Group accelerates 3D-IC packaging roadmap with breakthrough wafer bonding technology

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company's industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion and hybrid wafer bonding, the SmartView NT3 aligner provides sub-50-nm wafer-to-wafer alignment accuracy - a 2-3X improvement - as we [...]