LayTec: OIPT and LayTec collaborate on high-volume front-end processing

Plasma etch and deposition processing system maker Oxford Instruments Plasma Technology (OIPT) of Yatton, Bristol, UK and in-situ metrology system maker LayTec AG of Berlin, Germany have announced an exclusive collaboration agreement to enable the requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTec's accuracy and control with Oxford Instruments' wafer processing expertise...