iNEMI: iNEMI Forming Two Warpage-Related Projects

Package Warpage Prediction and Characterization High Density Interconnect Socket Warpage Prediction and Characterization Join iNEMI for a call-for-participation webinar that will review two new warpage-related projects currently in sign-up. Package Warpage Prediction and Characterization Project Dynamic warpage characterization of electronic packages is critical for high-yield board assembly. One of the challenges is to predict the [...] The post iNEMI Forming Two Warpage-Related Projects appeared first on EMSNow.