Source: Coventor Blog

Coventor Blog A Deposition and Etch Technique to Lower Resistance of Semiconductor Metal Lines

Introduction Cu's resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of Cu wires is traditionally [...]The post A Deposition and Etch Technique to Lower Resistance of Semiconductor Metal Lines appeared first on Coventor.

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