Printed circuit board (PCB) laser depaneling is an effective way for manufacturers to save money and time. Boards often contain sensitive components that can be damaged easily and laser depaneling reduces undue stress on these components and their solder joints. To avoid unnecessary setbacks, be sure to have a proper understanding of the different methods for PCB depaneling. In this post, we will take a deep dive into the components of laser routing or cutting for PCB depaneling and the key challenges they can solve for manufacturers. Choosing Laser Routing (Cutting) for PCB Depaneling Laser routing, or laser cutting, has become a popular method for depaneling. This process makes no physical contact with board, eliminating the problem of physical stress. Many manufacturers have chosen laser routing as its ideal for flexible, highly sensitive, small PCBs used in the latest wearable technologies. The two most commonly used lasers for PCB depaneling are CO2 (10.6µm wavelength) and UV (355nm wavelength). The main deciding factor when determining which laser to use is the relative importance of cycle time versus cleanliness of the cut edge. Selecting the Right Laser Source: Pros & Cons Determining the right laser source for your PCB depaneling needs should be your first priority. Let's look at the pros and cons of CO2 vs. UV lasers: CO2 Lasers: If cycle time is more important than char, a CO2 laser source is utilized. Pros: Fast cut speeds, lower cost per watt than UV, perforated or full cut (see below) option, thicker substrates cut efficiently, and aluminum panels can be processed. Cons: More charring on cut edges, larger HAZ, and larger kerf width. CO2 lasers, which can be used to create full cuts, are more frequently used to make perforated cuts. Perforated cuts for PCB depaneling leave the "to-be" singulated board attached Continue ReadingThe post Key Components of Laser Routing and Cutting Systems for PCB Depaneling appeared first on Industrial Laser Systems for Precision Mfg | CMS Laser.