3DiS Technologies will be presenting “Wafer-level 3D system packaging of IoT devices enabled by conformal 3D Interconnects” during startup pitch session. Kindly attend our presentation the 27th of June at 4:30 pm.   SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, […]
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